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(Wireless-NewsWire.Com, June 16, 2017 ) According to Publisher, the Global Photonic Integrated Circuit (IC) market is estimated at $ 366.47 million in 2015 and is expected to reach $2458.90 million by 2022 growing at a CAGR of 31.3% from 2015 to 2022. Increase in level of integration and decrease in size of the devices are the key factors fueling the market growth. Low level of digitalization is restraining the market. Demand for Photonic technology is major opportunity for the market.
In raw material segment, indium phosphide (InP) holds the largest market share owing to demand for high speed data transmission. But Silica-on-Silicon segment is anticipated to grow at highest CAGR during forecast period. Optical communication in application commanded owing to increase data users, Whereas Optical signal processing is expected to hold the largest share during forecast period. In component, Lasers segment holds the largest market share and Multiplexers/De-Multiplexers is anticipated to be move at highest CAGR.
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North America leads the global Photonic Integrated Circuit (IC) market in 2015. Asia-Pacific region is a prospective market and is anticipated to make a quick market growth due to rapid development taking place in biophotonics.
Some of the key players in the market include Te Connectivity, Hewlett-Packard, Onechip, Photonics, Finisar Corporation, Oclaro, Enablence Technologies, Neophotonics Corporation, Emcore Corporation, Luxtera, Cyoptics, Kotura, Ciena Corporation, Kaiam Corporation, Avago Technologies, Jds Uniphase Corporation, Alcatel-Lucent, Intel Corporation, Aifotec Ag, Infinera Corporation, Agilent Technologies.
Raw Materials Covered:
- Silicon-on-Insulator
- Indium Phosphide (InP)
- Lithium Niobate (LiNbO3)
- Gallium Arsenide (GaAs)
- Silicon (Si)
- Other Raw Materials
o Silicon Nitride (Si3Ni4)
o Silica-On-Silicon
o Silicon Dioxide (SiO2)
Applications Covered:
- Optical Signal Processing
o Quantum Optics
o Optical Metrology
o Quantum Computing
o Optical Instrumentation
- Optical Communications
o Long-Haul and Transport Networks
o Fttx and Access Networks
o Optical Datacom
o Microwave/RF Photonics
- Biophotonics
o Analytics and Diagnostics
o Medical Instrumentation
o Optical Biosensors
o Photonic Lab-On-A-Chip
- Sensing
o Transport and Aerospace
o Structural Engineering
o Energy and Utilities
o Chemical Sensors
Integration Types Covered:
- Module Integration
- Hybrid Integration (Packaging Integration)
- Monolithic Integration
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Components Covered:
- Multiplexers/De-Multiplexers
- Detectors
- Lasers
- Optical Amplifiers
- Modulators
- Attenuators
Regions Covered:
- North America
o US
o Canada
o Mexico
- Europe
o Germany
o France
o Italy
o UK
o Spain
o Rest of Europe
- Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o Rest of Asia Pacific
- Rest of the World
o Middle East
o Brazil
o Argentina
o South Africa
o Egypt
11 Company Profiling
11.1 Te Connectivity
11.2 Hewlett-Packard
11.3 Onechip Photonics
11.4 Finisar Corporation
11.5 Oclaro
11.6 Enablence Technologies
11.7 Neophotonics Corporation
11.8 Emcore Corporation
11.9 Luxtera
11.10 Cyoptics
11.11 Kotura
11.12 Ciena Corporation
11.13 Kaiam Corporation
11.14 Avago Technologies
11.15 Jds Uniphase Corporation
11.16 Alcatel-Lucent
11.17 Intel Corporation
11.18 Aifotec Ag
11.19 Infinera Corporation
11.20 Agilent Technologies
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Priya Sisodia
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