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(Wireless-NewsWire.Com, May 23, 2018 ) The global 3D TSV and 2.5D market is expected to project a growth rate of 35.2% during the forecast period (2018 - 2023).
Connected devices and other wireless technologies like Wi-Fi and Bluetooth, are some of the features integrated in smart gadgets and devices for communicating with other devices. Several integrated circuits need to be incorporated in a single chip module for reducing the board space and cost. Miniaturization of electronic devices and the rapid growth of smartphones and tablets are also expected to influence the demand of the market.
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Expanding Market for Smartphones, Tablets, and Gaming Devices:
Advanced transformations of the consumer electronics require manufacturers to improve the offerings in terms of design, processing power, power consumption, and user interface, frequently. Such upgrades in consumer electronics will require the use of robust technology. 3D TSV is the core of integrated chip packaging on a nanometer scale ensuring robust hardware for technology. Shipments of smartphones is expected to reach 2 billion units by 2020, majorly due to the availability of low-cost smartphones in developing nations, such as China and India.
Asia-Pacific to Occupy a Significant Market Share:
Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia have recorded high levels of manufacturing in the consumer electronics, automotive, and transportation sectors, which a key source of demand for 3D TSV and 2.5D market in the region. The rising popularity of smartphones and demand for new memory technologies has increased the growth of computationally intensive consumer electronics, thereby creating a wide range of opportunities in this region. Asia-Pacific is one of the most active manufacturing hubs in the world.
Key Developments in the Market:
March 2017 - Advanced Semiconductor Engineering, Inc., and Cadence Design Systems, Inc., announced they have collaborated to release a System-in-Package (SiP) EDA solution, that addresses the challenges of designing and verifying Fan-Out Chip-on-Substrate (FOCoS) multi-die packages.
Major Players:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, SAMSUNG ELECTRONICS CO. LTD, TOSHIBA CORP., PURE STORAGE INC., ADVANCED SEMICONDUCTOR ENGINEERING INC., AMKOR TECHNOLOGY, UNITED MICROELECTRONICS CORP., STMICROELECTRONICS NV, BROADCOM LTD, INTEL CORPORATION, JIANGSU CHANGING ELECTRONICS TECHNOLOGY CO. LTD, amongst others.
Reasons to Purchase this Report:
Impact of growing demand for smartphones and tablets.
Analyzing various perspectives of the market with the help of Porter’s five forces analysis.
Growth of various products such as - MEMS, Sensors, and Optpelectronics.
Regional analysis of the market.
Identify the latest developments, market shares, and strategies employed by the major market players.
3 months analyst support, along with the Market Estimate sheet (in excel).
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Customization of the Report:
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Companies Mentioned:
Taiwan Semiconductor Manufacturing Company Limited, Samsung Electronics Co. Ltd, Toshiba Corp., Pure Storage Inc., Advanced Semiconductor Engineering Inc., Amkor Technology, United Microelectronics Corp., STMicroelectronics NV, Broadcom Ltd, Intel Corporation, and Jiangsu Changing Electronics Technology Co. Ltd
Table Of Content:
1.Introduction
2.Research Approach and Methodology
3.Executive Summary
4.Market Dynamics
5.Global 3D TSV and 2.5D IC Market – Segmentation
6.Competitive Intelligence - Company Profiles
7.Investment Analysis
8.Outlook of 3D TSV and 2.5D IC Market
Orbis Research
Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
Source: EmailWire.Com 
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